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Printed circuit boards(PCBs) with characteristic impedance control are widely used in high |
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frequency circuit. PCB's that mixed high frequency material can reduce signal loss at high |
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frequencies and meet the development needs of communication technology. |
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The stack-up of multilayer boards can be done in many different ways. The choice is often |
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determined by the types of thin laminate and prepreg sheet we have in the stock. Normally |
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the most cost-effective stack-up list is to be chosen unless there're special demands for |
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the controlled impedances, EMC-shielding or frequency etc. |
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4 Layer PCB, RO4350B mixed with FR-4 core |
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| --- ---------- LAYER 1 (TOP LAYER) 0.5OZ+PLATE |
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| Pre-Preg 10MIL RO4350B |
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| ---------- LAYER 2 (MID LAYER 1) 0.5OZ |
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1.6 mm +/-10% Core FR-4 |
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| ---------- LAYER 3 (MID LAYER 2) 0.5OZ |
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| Pre-Preg 20MIL RO4350B |
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| --- ---------- LAYER 4 (BOTTOM LAYER) 0.5OZ+PLATE |
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